{"id":7323,"date":"2021-06-01T08:35:03","date_gmt":"2021-06-01T06:35:03","guid":{"rendered":"https:\/\/phpstack-458049-1434344.cloudwaysapps.com\/?p=7323"},"modified":"2021-06-01T08:35:04","modified_gmt":"2021-06-01T06:35:04","slug":"amd-auf-der-computex-zen-4-mit-3d-stacking","status":"publish","type":"post","link":"https:\/\/www.caseking.de\/blog\/amd-auf-der-computex-zen-4-mit-3d-stacking","title":{"rendered":"AMD auf der Computex: Zen 4 mit 3D-Stacking"},"content":{"rendered":"\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<p class=\"wp-block-paragraph\">Auf der Computex 2021 hat AMDs CEO Dr. Lisa Su \u00fcber neue Technologie und neue Produkte gesprochen und einen Ausblick auf kommende Ryzen-Prozessoren auf Basis der Zen 4-Mikroarchitektur gegeben:<\/p>\n\n\n\n<figure class=\"wp-block-embed aligncenter is-type-video is-provider-youtube wp-block-embed-youtube wp-embed-aspect-16-9 wp-has-aspect-ratio\"><div class=\"wp-block-embed__wrapper\">\n<iframe title=\"AMD at Computex 2021\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/gqAYMx34euU?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe>\n<\/div><figcaption>AMD at Computex 2021 (AMD YouTube)<\/figcaption><\/figure>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<hr class=\"wp-block-separator aligncenter is-style-wide\"\/>\n<\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">AMD Ryzen<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Unter dem Konzept der Advanced Technology vereint AMD die Herstellungsprozesse und das Packaging der Chips unter einem Hut. Durch das Verbinden dieser beiden Ans\u00e4tze will AMD die besten Herstellungsverfahren mit den besten Packaging-Technologien kombinieren.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr Ryzen-Prozessoren bedeutet dies, dass die Zen 4-Mikroarchitektur in TSMCs 5-nm-Prozess hergestellt wird und mit der 3D V-Cache-Technologie kombiniert wird. So kann zus\u00e4tzlicher L3-Cache auf dem Core Chiplet Die (CCD) gestapelt werden. <\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"576\" src=\"https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking-1024x576.jpg\" alt=\"\" class=\"wp-image-7325\"\/ loading=\"lazy\" srcset=\"https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking-1024x576.jpg 1024w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking-300x169.jpg 300w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking-768x432.jpg 768w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking-1536x864.jpg 1536w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking-462x260.jpg 462w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Chiplet-Stacking.jpg 1920w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><figcaption>AMD 3D V-Cache-Technologie (Bild: AMD)<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Intel verwendet f\u00fcr die kommenden &#8222;Alder Lake&#8220;-CPUs mit &#8222;Foveros&#8220; einen \u00e4hnlichen Ansatz des 3D-Stackings und kombiniert so mehrere Chiplets \u00fcbereinander auf einem Die.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In einem Beispiel f\u00fcr das 3D V-Cache-Stacking hat AMD einen Ryzen 9 5900 X mit 64 MByte zus\u00e4tzlichem L3-Cache ausgestattet.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"595\" src=\"https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot-1024x595.png\" alt=\"\" class=\"wp-image-7326\"\/ loading=\"lazy\" srcset=\"https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot-1024x595.png 1024w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot-300x174.png 300w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot-768x446.png 768w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot-1536x892.png 1536w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot-462x268.png 462w, https:\/\/www.caseking.de\/blog\/wp-content\/uploads\/2021\/06\/Die-Shot.png 1612w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><figcaption>AMD Ryzen 9 5900X mit zus\u00e4tzlichem L3-Cache (Bild: AMD)<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Im Durchschnitt soll die Performance in Spielen um 15 Prozent durch den erh\u00f6hten L3-Cache gesteigert werden k\u00f6nnen. In Einzelf\u00e4llen soll sogar ein Performance-Boost um bis zu 25% Leistung verbuchbar sein.<\/p>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<hr class=\"wp-block-separator aligncenter is-style-wide\"\/>\n<\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">AMD FidelityFX Super Resolution<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Neben neuen APUs, CPUs und Mobile-Grafikkarten hat AMD auch AMD FidelityFX Super Resolution vorgestellt, welches noch diesen Sommer erscheinen wird. Mehr zu diesem Thema wirr sp\u00e4ter in unserem Blog folgen, hier nochmal die Pr\u00e4sentation:<br><\/p>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<figure class=\"wp-block-embed aligncenter is-type-video is-provider-youtube wp-block-embed-youtube wp-embed-aspect-16-9 wp-has-aspect-ratio\"><div class=\"wp-block-embed__wrapper\">\n<iframe title=\"AMD FidelityFX Super Resolution: Supercharged Performance\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/eHPmkJzwOFc?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe>\n<\/div><figcaption>AMD FidelityFX Super Resolution: Supercharged Performance<\/figcaption><\/figure>\n<\/div><\/div>\n<\/div><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Auf der Computex 2021 hat AMDs CEO Dr. Lisa Su &uuml;ber neue Technologie und neue Produkte gesprochen und einen Ausblick auf kommende Ryzen-Prozessoren auf Basis der Zen 4-Mikroarchitektur gegeben: AMD Ryzen Unter dem Konzept der Advanced Technology vereint AMD die Herstellungsprozesse und das Packaging der Chips unter einem Hut. Durch das Verbinden dieser beiden Ans&auml;tze [&hellip;]<\/p>\n","protected":false},"author":34,"featured_media":7324,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[2226,2227],"tags":[2363,1283,220],"class_list":["post-7323","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-tech-hardware","tag-am5","tag-amd-cpus","tag-amd-ryzen"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.0 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>AMD auf der Computex: Zen 4 mit 3D-Stacking - Caseking Blog | Gaming-PCs, Hardware-News &amp; Modding-Guides<\/title>\n<meta name=\"description\" content=\"Auf der Computex 2021 hat AMDs CEO Dr. Lisa Su \u00fcber neue Technologie und neue Produkte gesprochen und einen Ausblick auf kommende Ryzen-Prozessoren auf\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.caseking.de\/blog\/amd-auf-der-computex-zen-4-mit-3d-stacking\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"AMD auf der Computex: Zen 4 mit 3D-Stacking - Caseking Blog | Gaming-PCs, Hardware-News &amp; 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Schon in der Schulzeit entwickelte er eine Leidenschaft f\u00fcr Technik und Gaming \u2013 seinen ersten PC zerlegte er direkt nach dem Auspacken, einfach um zu verstehen, wie er funktioniert. Bis heute baut er regelm\u00e4\u00dfig Gaming-PCs f\u00fcr sich und Freunde zusammen. Wenn er gerade nicht an seinem PC herumschraubt, taucht er gerne in die Welt der Anime ein und tr\u00e4umt davon, einmal Japan zu bereisen. In seiner Freizeit trifft man ihn entweder beim Zocken des neuesten AAA-Titels oder dabei, seine Teammates in League of Legends (mehr oder weniger absichtlich) zu inten.","url":"https:\/\/www.caseking.de\/blog\/author\/marcel-bruns"}]}},"_links":{"self":[{"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/posts\/7323","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/users\/34"}],"replies":[{"embeddable":true,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/comments?post=7323"}],"version-history":[{"count":1,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/posts\/7323\/revisions"}],"predecessor-version":[{"id":7327,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/posts\/7323\/revisions\/7327"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/media\/7324"}],"wp:attachment":[{"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/media?parent=7323"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/categories?post=7323"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.caseking.de\/blog\/wp-json\/wp\/v2\/tags?post=7323"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}