AMD Ryzen 5 7600X3D 4.7 GHz (Raphael) AM5 - boxed

The AMD Ryzen 5 7600X3D at a glance:

• 6 "Zen 4" cores with just 65 W Thermal Design Power (TDP)
• 12 threads thanks to Simultaneous Multithreading (SMT)
• Very high single- and multi-thread performance
• Base clock of 4.1 GHz & 4.7 GHz Turbo with Precision Boost 2
• Fast PCI-Express 5.0 interface
• Massive L3 cache: 96 MB 3D V-Cache
• Compatible with the AMD AM5 processor socket
• Native support for DDR5 RAM with a maximum of 5,200 MHz (dual-channel)
• No CPU cooler included!

The AMD Ryzen 5 7600X3D 6-core CPU with 4.7 GHz Precision Boost 2

The AMD Ryzen 5 7600X3D from the Raphael processor family features six CPU cores based on the "Zen 4" architecture. Following "Zen 3," this represents the fifth generation of the Zen microarchitecture. Compared to the previous generation, each processor core now has access to the entire L3 cache, significantly improving gaming performance. Additionally, Ryzen 7000 processors offer a much-improved per-clock performance and a higher boost clock.

Paired with an AMD X670(E) or B650(E) chipset, the AMD Ryzen 5 7600X3D supports the PCI-Express 5.0 standard, which is twice as fast as PCIe 4.0. All Ryzen 7000 processors use the AM5 platform and are designed for use with compatible AMD chipsets. A BIOS update is required for compatibility.

The AMD Ryzen 5 7600X3D features six physical CPU cores, which, thanks to Simultaneous Multithreading (SMT), can process two threads per core, effectively doubling the number of computing threads to 12. The 6-core processor operates at a high base clock of 4.1 GHz per core, which dynamically adjusts in real-time using Precision Boost 2 and, within the thermal design power (TDP) of 65 watts, can reach up to 4.7 GHz turbo.

The CPU core silicon is manufactured using an advanced 5 nm FinFET process with stacked transistors (also known as 3D transistors) using Extreme Ultraviolet (EUV) lithography. The reduced structure size allows for the integration of more cache memory.

The I/O chiplet within the CPU package is produced using a 6 nm FinFET process and provides 24 PCIe lanes, with four lanes each reserved for connectivity to the motherboard chipset and NVMe SSDs. This leaves 16 lanes available for communication with graphics cards, while additional PCIe lanes for further storage devices, expansion cards, and peripherals depend on the motherboard chipset.