EK Water Blocks Thermal Pad E 1.5mm - (RAM 8x)

Thermal pads are a real alternative to traditional thermal pastes for many applications. The thermal pads offer several advantages over liquid or viscous materials. The pads can easily be cut to the required size with scissors or a cutter, eliminating the uncertainty of applying paste or the smudging that occurs during smoothing. The pad offered here by EK Water Blocks is already pre-cut into eight smaller pieces, is slightly self-adhesive, and usually stays in place initially at the assigned position.

Of course, fixing it during the further assembly process cannot be completely avoided, as the heat source, thermal pad, and heatsink (or the heat dissipation surface) should ideally come into as large contact as possible to ensure optimal heat transfer. EKWB also maximally supports the user in this regard, as the 100 x 16 mm blue pad is available in several thicknesses, with the version offered here being 1.5 mm thick. Additionally, the material is pleasantly flexible and adaptable, making it usable in many areas.

To name just a few application examples: with RAM water coolers, alternative graphics card coolers, chipset coolers, and many other components where it is crucial to effectively dissipate waste heat (e.g. on cooling fins, heat pipes, radiators, heatsinks, etc.). Since the EKWB thermal pads do not conduct electricity, there are hardly any limits to creativity with most electronic components. On the other hand, the pads, with a high thermal conductivity of 3.5 W/(m·K), make some thermal pastes look outdated.

The pads presented here are ideal for the chipsets of a memory module, as the overall 100 x 16 mm strip has already been cut into eight smaller pieces of 12.5 x 16 mm each.

Note: The application is at your own risk! Caseking assumes no liability for damages due to improper use or due to use in unsuitable application areas. Sufficiently high heat transfer should be carefully checked after installation!