Thermal pads represent a real alternative to traditional thermal pastes for many applications. The thermal pads offer several advantages over liquid or viscous materials. For instance, the pads can easily be cut to the required size with scissors or a cutter, eliminating the uncertainty of applying paste or the smearing that occurs during smoothing. The pad offered here by EK Water Blocks is already pre-cut into eight smaller pieces, is slightly self-adhesive, and usually stays in place initially.
Of course, securing it during the further assembly process cannot be completely avoided, as the heat source, thermal pad, and heatsink (or heat dissipation surface) should come into as large contact area as possible to ensure optimal heat transfer. EKWB also maximally supports the user in this regard by offering the blue pad, measuring 120 x 16 mm, in several thicknesses, with the version offered here being 1.5 mm thick. Additionally, the material is pleasantly flexible and adaptable, making it usable in many places.
To name just a few application examples: in RAM water coolers, alternative graphics card coolers, chipset coolers, and many other components where effective heat dissipation is crucial (e.g., on cooling fins, heat pipes, radiators, heatsinks, etc.). Since the EKWB thermal pads do not conduct electricity, there are hardly any limits to creativity with most electronic components. On the other hand, the pads, with a high thermal conductivity of 3.5 W/(m·K), make many thermal pastes look outdated. The pad presented here is ideal for the chipsets of a memory module, as the overall 120 x 16 mm strip can be cut to size as desired.
Note: The application is at your own risk! Caseking assumes no liability for damages caused by improper use or by use in unsuitable application areas. Adequate heat transfer should be carefully checked after installation!
Technical details:
Of course, securing it during the further assembly process cannot be completely avoided, as the heat source, thermal pad, and heatsink (or heat dissipation surface) should come into as large contact area as possible to ensure optimal heat transfer. EKWB also maximally supports the user in this regard by offering the blue pad, measuring 120 x 16 mm, in several thicknesses, with the version offered here being 1.5 mm thick. Additionally, the material is pleasantly flexible and adaptable, making it usable in many places.
To name just a few application examples: in RAM water coolers, alternative graphics card coolers, chipset coolers, and many other components where effective heat dissipation is crucial (e.g., on cooling fins, heat pipes, radiators, heatsinks, etc.). Since the EKWB thermal pads do not conduct electricity, there are hardly any limits to creativity with most electronic components. On the other hand, the pads, with a high thermal conductivity of 3.5 W/(m·K), make many thermal pastes look outdated. The pad presented here is ideal for the chipsets of a memory module, as the overall 120 x 16 mm strip can be cut to size as desired.
Note: The application is at your own risk! Caseking assumes no liability for damages caused by improper use or by use in unsuitable application areas. Adequate heat transfer should be carefully checked after installation!
Technical details:
- Dimensions (Total): 120 x 16 mm (L x W)
- Thickness: 1.5 mm
- Quantity: 1 strip
- Thermal conductivity: 3.5 W/(m·K)
- Operating temperature: -55 to +200 °C
Colour
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Primary Colour
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Blue
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Dimensions
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Length / Depth
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120 mm
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Width
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16 mm
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Height
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1.5 mm
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Thermal Specifications
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Min. Operating Temperature
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-55 °C
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Max. Operating Temperature
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200 °C
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Thermal conductivity
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3.5 W/mK
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Density
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2.6 g/cm³
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Manufacturer Information | EKWB d.o.o. Pod lipami 18, 1218 Komenda, Slovenien |
Responsible Person | EKWB d.o.o. Pod lipami 18, 1218 Komenda, Slovenien |