High-Performance Alternative to Thermal Paste
With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.
The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore optimal for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as a heat transfer medium, achieving a similar thermal conductivity to thermal paste.
The Minus Pad is available in various dimensions and thicknesses ranging from 0.5 to 3 millimetres. Since it works optimally even under minimal contact pressure and thermal conductivity is hardly affected by thickness, the choice of thickness should only be aligned with the distance to be bridged.
Colour
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Primary Colour
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Grey
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Dimensions
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Length / Depth
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100 mm
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Width
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100 mm
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Height
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1.5 mm
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Materials
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Materials
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Aluminium oxide
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Electrically Conductive
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No
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Manufacturer Information | Thermal Grizzly Holding GmbH Gewerbestraße 39, 16540 Hohen Neuendorf, Deutschland |
Responsible Person | Thermal Grizzly Holding GmbH Gewerbestraße 39, 16540 Hohen Neuendorf, Deutschland |