High-performance alternative to thermal paste
With the Thermal Grizzly Minus Pad Basic, the Hamburg cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.
The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heatsink needs to be bridged. It is therefore perfectly suited for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as a heat transfer medium, achieving a similar thermal conductivity to thermal paste.
The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimetres. Since it functions optimally even under minimal contact pressure and its thermal conductivity is hardly affected by thickness, the choice of thickness should only be based on the distance to be bridged.
Colour
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Primary Colour
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Grey
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Dimensions
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Length / Depth
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120 mm
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Width
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20 mm
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Height
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3 mm
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Materials
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Materials
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Aluminium oxide
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Electrically Conductive
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No
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Manufacturer Information | Thermal Grizzly Holding GmbH Gewerbestraße 39, 16540 Hohen Neuendorf, Deutschland |
Responsible Person | Thermal Grizzly Holding GmbH Gewerbestraße 39, 16540 Hohen Neuendorf, Deutschland |