Thermal Grizzly Ryzen 7000 Delid-Die-Mate - Ryzen 7000 & 9000 CPUs

Why "delidding" & direct die method for Ryzen 7000?

During delidding, or "de-lidding", the heat spreader of the processor is removed. For non-soldered processors, delidding is typically used to replace the thermal interface material (TIM) between the CPU die and the heat spreader with high-quality thermal paste or liquid metal before the heat spreader is reattached. However, since the Ryzen 7000 processors are soldered, this is not an option, as removing the indium solder would create too large a gap between the IHS and the CPU dies.

Therefore, the Ryzen 7000 CPUs are primarily delidded for the potential mounting of the CPU cooler directly onto the CPU dies. In the case of Ryzen 7000 CPUs, this would involve the I/O die (IOD) and one or two CPU dies (CCDs), known as "chiplets." By omitting the heat spreader and mounting the CPU cooler directly onto the dies, temperatures can be reduced by 10-20 °C when liquid metal such as Conductonaut is used as TIM. Relevant tests have been conducted by content creators and tech YouTubers Roman "der8auer" Hartung, a professional overclocker and engineer, as well as Jason "JayzTwoCents" Langevin.

These significant temperature improvements from direct die are also partly due to the heat spreader of the Ryzen 7000 processors. The heat spreaders for the AM5 platform, introduced with Ryzen 7000, are thicker than older heat spreaders, such as AM4. This was done to ensure compatibility of older CPU coolers that are compatible with AM4 for the AM5 platform. Additionally, the surface area of the Ryzen 7000 heat spreaders is significantly smaller at approximately 910 mm² compared to AM4 at 1,300 mm².