The EVGA Frostbite 2 thermal paste is a newly developed silicone paste that ensures consistent and reliable thermal performance with a thermal conductivity of 1.5 W/mK.
Due to the optimal consistency, application is now even easier, and the particle size has been further reduced, resulting in the last remaining small gap between the CPU core and the heatsink being uniformly filled. The effect: low temperatures.
The application range is between -40 °C and 180 °C. The paste is electrically non-conductive.
Due to the optimal consistency, application is now even easier, and the particle size has been further reduced, resulting in the last remaining small gap between the CPU core and the heatsink being uniformly filled. The effect: low temperatures.
The application range is between -40 °C and 180 °C. The paste is electrically non-conductive.
- Quantity: 2.5 grams
- Thermal resistance: 0.035 °C-cm²C/W
- Thermal conductivity: 1.5 W/mK
- Application range: -40 °C to 180 °C
Contents
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Weight (Contents)
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2.5 g
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Thermal Specifications
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Thermal conductivity
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1.5 W/mK
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Manufacturer Information | Caseking GmbH Gaußstraße 1, 10589 Berlin, Germany [email protected] |
Responsible Person | Caseking GmbH Gaußstraße 1, 10589 Berlin, Germany [email protected] |