The EK-Loop Thermal Paste NGP is a reliable thermal paste, designed for demanding systems. Thanks to the advanced Nano-Grade-Particle (NGP) technology, this thermal paste enables efficient heat transfer between CPUs, GPUs, or other chipsets and heatsinks.
An effective thermal conductivity and improved system performance are provided by the EK-Loop Thermal Paste NGP with a high thermal conductivity of 6.9 W/mK. Additionally, it offers excellent scratch resistance and durability, and is resistant in a temperature range of -20°C to 125°C.
Application is made easy with the included spatula. Together with the nozzle design and the spatula, nothing stands in the way of your perfect layer of thermal paste.
Technical Details:
- Colour: Grey
- Quantity: 5 grams
- Density: 2.98 g / cm³
- Thermal conductivity: 6.9 W/mK
- Application range: -20 to 125 °C
- Scope of delivery:
1x thermal paste
1x spatula
Contents
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Weight (Contents)
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5 g
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Thermal Specifications
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Min. Operating Temperature
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-20 °C
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Max. Operating Temperature
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125 °C
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Thermal conductivity
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6.9 W/mK
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Density
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2.98 g/cm³
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