Here’s the translation:
Thermal Grizzly from Hamburg is a new German brand that has committed itself to the fight against high temperatures and poor heat transfer. The goal is to supply the overclocking community with high-performance thermal interface products, which remain a weak point in the industry. However, the product portfolio can also be used for better and quieter cooling of gaming PCs, workstations, mini-PCs, and many other purposes. In addition to higher clock speeds, better thermal interface products enable quieter cooling and longer lifespan of the components being cooled.
To achieve these goals, Thermal Grizzly worked closely with the well-known extreme overclocker Roman "der8auer" Hartung during product development. Together, they tested, developed chemical compositions, and analyzed competitors. Now, the first product lines have been completed, which meet the highest standards of the manufacturer and the overclocking community.
For applications where thermal paste is not suitable due to difficult application, or where gaps need to be bridged between the heat source and the heat sink, the Thermal Grizzly Minus Pad 8 is the ideal choice—such as on memory chips and voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium—just like thermal pastes, making it similarly effective.
The Minus Pad 8 is available in three different sizes—here in 100 x 100 mm—as well as in four thicknesses ranging from 0.5 to 2 millimeters. The pads work excellently even with very low contact pressure, and the thermal conductivity is only slightly influenced by the thickness. Therefore, the choice of thickness should depend solely on the gap that needs to be bridged.
Warning! Please observe the manufacturer's warning notices before use!
Technical Details:
To achieve these goals, Thermal Grizzly worked closely with the well-known extreme overclocker Roman "der8auer" Hartung during product development. Together, they tested, developed chemical compositions, and analyzed competitors. Now, the first product lines have been completed, which meet the highest standards of the manufacturer and the overclocking community.
For applications where thermal paste is not suitable due to difficult application, or where gaps need to be bridged between the heat source and the heat sink, the Thermal Grizzly Minus Pad 8 is the ideal choice—such as on memory chips and voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium—just like thermal pastes, making it similarly effective.
The Minus Pad 8 is available in three different sizes—here in 100 x 100 mm—as well as in four thicknesses ranging from 0.5 to 2 millimeters. The pads work excellently even with very low contact pressure, and the thermal conductivity is only slightly influenced by the thickness. Therefore, the choice of thickness should depend solely on the gap that needs to be bridged.
Warning! Please observe the manufacturer's warning notices before use!
Technical Details:
- Dimensions: 100 x 100 x 1.5 mm
- Quantity: 1
- Operating temperature: -100 to +200 °C
- Color: Beige
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Beige
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